Bond Scanner for Glue Line and Seam Inspection
The Waygate Technologies‘ Bond Scanner makes glue line and bond seam ultrasonic testing fast, reliable and repeatable. The Bond Scanner is usually simply clamped on two body panels joined by a seam bond. The innovative array design (patent pending) enables the array to adopt also to contoured parts as commonly used in automobile designs and covering bond lines up to 32 mm width.
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Since the spring-loaded encoder wheel is located on the other side of the plate combination a firm and stable position of the array can be realized. The specially designed protection foil reduces the needed couplant to a minimum and enables manual, one-handed scanning. Complete sections of car body bond seams (e.g. on hoods, doors or other mounted parts) can be inspected in just one scan.
Features and Benefits
- Flexible, adaptive 10 MHz array
- 64 elements, 0.5 mm pitch for 32 mm coverage
- Spring loaded and sealed encoder for optimal positioning
- Protective foil for reducing wear and couplant need
- Ergonomic handling, smooth scanning operation
- Silicone oil free
Bond Scanners are ideally paired with the Krautkrämer Mentor UT flaw detector for consistency across the inspection process. The user-defined workflows walk the inspector through every step of instrument setup — from probe selection and calibration to reporting.
